1. Adopting international latest technology for the production of die chips 2. Low leakage current, low power, high reliability. 3. Excellent impact resistance for instantaneous high current. 4. Reverse avalanche breakdown. 5. Working temperature-40 ℃.~+130 ℃. 6. Various sizes or customized 7. High voltage rectifier, isolation and protective effect in circuits. 8. Environmental-friendly technology and complying with international standards.

1. Low leakage,resistant to surge ,resistant to shock. 2. Great avalanche voltage breakdown protection features. 3. High heat resistance,PN junction temperature peak 130℃ 4. Environmentally friendly process,international standards 5. Using epoxy resin molding vacuum package, with corrosion resistant surface

1. Various sizes are customizable, installation and wiring are easy 2. Low forward voltage drop, low leakage current 3. Avalanche breakdown protection 4. High surge current discharge impact 5. Junction temperature 150~175 oC., excellent high temperature performance 6. Epoxy package with anti-corrosion properties on surface

1. Adopting international latest technology for the production of die chips assembly 2. Low leakage current, low power, high reliability. 3. Excellent impact resistance for instantaneous high current. 4. Reverse avalanche breakdown. 5. Working temperature-40 oC. ~+130 oC.. 6. Various sizes or customized 7. High voltage rectifier, isolation and protective effect in circuits.

1. Adopting international latest technology for the production of die chips assembly 2. Low leakage current, low power, high reliability. 3. Excellent impact resistance for instantaneous high current. 4. Reverse avalanche breakdown. 5. Working temperature-40 oC ~+130 oC.. 6. Various sizes or customized 7. High voltage rectifier, isolation and protective effect in circuits.

1. Adopting international latest technology for the production of die chips assembly 2. Low leakage current, low power, high reliability. 3. Excellent impact resistance for instantaneous high current. 4. Reverse avalanche breakdown. 5. Working temperature-40 oC. ~+130 oC.. 6. Various sizes or customized 7. High voltage rectifier, isolation and protective effect in circuits.

1. Adopting international latest technology for the production of die chips assembly 2. Low leakage current, low power, high reliability. 3. Excellent impact resistance for instantaneous high current. 4. Reverse avalanche breakdown. 5. Working temperature-40 oC. ~+130 oC.. 6. Various sizes or customized 7. High voltage rectifier, isolation and protective effect in circuits.

1. Adopting international latest technology for the production of die chips assembly 2. Low leakage current, low power, high reliability. 3. Excellent impact resistance for instantaneous high current. 4. Reverse avalanche breakdown. 5. Working temperature-40 oC. ~+130 oC.. 6. Various sizes or customized 7. High voltage rectifier, isolation and protective effect in circuits.

1. High efficiency cooling ceramic package 2. Excellent high temperature performance 3. Silicon chip adopts gold coated technology 4. High chip integration 5. Reliable connection and easy to install